>> My name is Robert Brennan.
I'm currently the engineer in charge of the thin-films SD group
for Tokyo Electron America here in Malta, New York.
We developed a metal layer or other substrate layer and we go
down to really, really small values.
We're talking nanometers.
And we make these really thin layers on top of semi-conductors
and this helps build the chip from the ground up.
Tools that come in, like if we have a customer who's purchased a bunch of tools,
the startup schedule could be broken down into weeks.
I've seen it even as short as five days where we've had a machine show up on the dock
in the back of a tractor trailer and then from that moment we have days to get it installed
into their clean room, get it up and running, do all of the checks,
make sure it passes the customers preliminary Quales and they can release it
and start running production through it.
And production is wait for some chips.
We had this one issue that had come
up where there was a severe mechanical problem with one of the machines.
Now simultaneously I'm trying to do this training project and get a beta started off
and running for that fall, but we also had to immediately figure out what was wrong
with this tool so trouble shooting plays a key factor in figuring out exactly what happened.
Looking at the machine logs and then actually just drawing pictures to try and say well,
if this did in fact happen, how do we prove
that everything else is Ok and that this is the problem?
Because ultimately in troubleshooting the only way that you can figure
out what actually happened is by proving that all the other systems are functioning correctly.
So we put together a plan, we figured out exactly how to execute it, we completed it,
we completed testing, everything came up, everything passed Quales,
the machine was running perfectly, the customer was happy, and then I went back
to completing the secondary project I had gone on, which I had a pretty tight deadline by.